Conference day 2 - 16 March 2017

Conference day 2

Thursday 16 March

  1. Event Registration and Pre-Conference Networking

  2. Chair's Opening Remarks

HDR Sensors and Chip Stacking

  1. BSI scientific CMOS sensors for life science and astronomy

    Xinyang Wang | Founder and CEO of GPixel

  2. 16MP image sensor embedding a 2.8um pixel pitch with true CDS Global Shutter Operation

    Frederic Mayer | Device Engineer of e2V

    • New 16Mp sensor overview
    • Focus on the new pixel architecture a. Operation modes, b. Measured performance
    • Sensor architecture and features a. Architecture, b. Speed, c. Digital features, 4. Product Roadmap of this 
  3. Advanced image sensor features for demanding applications

    Philippe Rommeveaux | President and CEO of Pyxalis

  4. Deep well pixel HDR technology

    Johannes Solhusvik | General Manager of Omnivision Technologies Norway AS

  5. Networking Refreshment Break

Machine and Computer Vision

  1. Dynamic Vision Sensor - Status and Applications

    Simeon Bamford | Chief Technology Officer of Inivation

  2. Implementing 360 degree video stitching in hardware

    James Hutchison | Principal Engineer of Argon Design

    • Real-time 360 degree hardware stitching
    • 8K@30fps output
    • 6GBytes/s memory bandwidth
    • 1 frame latency
  3. Achieving higher speeds for CMOS image sensor testing

    Minoru Mikami, Senior Engineer, Probe Card Designer and Silvano Mezzetti, Senior Staff Engineer, Product Solutions, FormFactor Inc

    As CMOS Image Sensors continue to grow at ~10% CAGR, a part of that market is driven by the need for speed. These new requirements relating to the incorporation on lens modules in the probe card have increased the difficulty of meeting this challenge. Last year we produced several card designs requiring 2.5Gbps for the differential pair and clock speeds as called out by MIPI D-PHY V1.2. However, new M-PHY opportunities require 3Gbps speeds for several differential pairs. In cooperation with key strategic supplier using new PCB materials and design rules, we were able to achieve loss characteristics of the probe card that was comparable to traditional high speed CIS probe card performance without a lens module. An Eye pattern simulation that used actual S-parameter data indicated we finally have enough signal quality to meet 3Gbps. However, as we look toward the future our next target of 5Gbps may require some structural changes.

  4. Market trends in image sensors for machine vision

    Ronald Muller, Consultant at Vision Markets and Report Author for Smithers Apex

  5. Networking Lunch

Looking to the Future and What's Next?

  1. Technology development of CMOS image sensors and future prospects

    Keiji Tatani | General Manager of SONY Semiconductor Solutions Corporation

Imaging and Colour

  1. Challenges of colour processing and ISP tuning

    Frederic Guichard | Chief Scientist and Co-Founder of DxO Labs

    • The miniaturisation of the camera has increased camera system complexity and in particular ISP complexity
    • This translates into many challenges in ISP tuning towards an ever increasing image quality demand
    • We will illustrate this by showing some of the challenges of color processing in miniaturised cameras
  2. Quantum Efficiency and Color

    Jörg Kunze | Teamleader NewTech of Basler

    • What are quantum efficiency (QE) spectra, how are they currently presented, and how can we improve?
    • What do perfect color QE spectra look like and what are the consequences of deviations?
    • How we can characterize QE spectra with a few meaningful numbers? This includes the introduction of the novel Sensor Color Ambiguity number
    • Why does Basler have a six-axes color adjustment and what does it do?
  3. NIR cut filters and FOPs for image sensors

    Ralf Biertümpfel | Product Manager Optical Filter of Schott

  4. Close of conference