Conference day 2 - 16 March 2017
Conference day 2
Event Registration and Pre-Conference Networking
Chair's Opening Remarks
BSI scientific CMOS sensors for life science and astronomy
Xinyang Wang | Founder and CEO of GPixel
16MP image sensor embedding a 2.8um pixel pitch with true CDS Global Shutter Operation
Frederic Mayer | Device Engineer of e2V
- New 16Mp sensor overview
- Focus on the new pixel architecture a. Operation modes, b. Measured performance
- Sensor architecture and features a. Architecture, b. Speed, c. Digital features, 4. Product Roadmap of this
Advanced image sensor features for demanding applications
Philippe Rommeveaux | President and CEO of Pyxalis
Deep well pixel HDR technology
Johannes Solhusvik | General Manager of Omnivision Technologies Norway AS
Networking Refreshment Break
Dynamic Vision Sensor - Status and Applications
Simeon Bamford | Chief Technology Officer of Inivation
Implementing 360 degree video stitching in hardware
James Hutchison | Principal Engineer of Argon Design
- Real-time 360 degree hardware stitching
- 8K@30fps output
- 6GBytes/s memory bandwidth
- 1 frame latency
Achieving higher speeds for CMOS image sensor testing
Minoru Mikami, Senior Engineer, Probe Card Designer and Silvano Mezzetti, Senior Staff Engineer, Product Solutions, FormFactor Inc
As CMOS Image Sensors continue to grow at ~10% CAGR, a part of that market is driven by the need for speed. These new requirements relating to the incorporation on lens modules in the probe card have increased the difficulty of meeting this challenge. Last year we produced several card designs requiring 2.5Gbps for the differential pair and clock speeds as called out by MIPI D-PHY V1.2. However, new M-PHY opportunities require 3Gbps speeds for several differential pairs. In cooperation with key strategic supplier using new PCB materials and design rules, we were able to achieve loss characteristics of the probe card that was comparable to traditional high speed CIS probe card performance without a lens module. An Eye pattern simulation that used actual S-parameter data indicated we finally have enough signal quality to meet 3Gbps. However, as we look toward the future our next target of 5Gbps may require some structural changes.
Market trends in image sensors for machine vision
Ronald Muller, Consultant at Vision Markets and Report Author for Smithers Apex
Technology development of CMOS image sensors and future prospects
Keiji Tatani | General Manager of SONY Semiconductor Solutions Corporation
Challenges of colour processing and ISP tuning
Frederic Guichard | Chief Scientist and Co-Founder of DxO Labs
- The miniaturisation of the camera has increased camera system complexity and in particular ISP complexity
- This translates into many challenges in ISP tuning towards an ever increasing image quality demand
- We will illustrate this by showing some of the challenges of color processing in miniaturised cameras
Quantum Efficiency and Color
Jörg Kunze | Teamleader NewTech of Basler
- What are quantum efficiency (QE) spectra, how are they currently presented, and how can we improve?
- What do perfect color QE spectra look like and what are the consequences of deviations?
- How we can characterize QE spectra with a few meaningful numbers? This includes the introduction of the novel Sensor Color Ambiguity number
- Why does Basler have a six-axes color adjustment and what does it do?
NIR cut filters and FOPs for image sensors
Ralf Biertümpfel | Product Manager Optical Filter of Schott
- True color recognition requires NIR cut filters. There are different technologies to block unwanted light. Absorbing filters are the preferred solution, but physics and chemistry give constraints.
- SCHOTT developed optimized coatings for filter glasses to increase performance and long time stability.
- Glass solutions for X-ray imaging are presented as well.
Close of conference