Pre-conference Workshop 1 (AM)
3-hour Workshop
Tuesday 20th March - 9.00am - 12.30pm
Title: Sensors Architectures for 3D Time-of-Flight Imaging
Led by:

Dr David Stoppa
Fondazione Bruno Kessler
Italy

Lucio Pancheri
Fondazione Bruno Kessler
Italy

Matteo Perenzoni
Fondazione Bruno Kessler
Italy
Workshop content
- General introduction about 3D Imaging Technologies, applications and history
- ToF 3D Imaging measurement principle and systems
- Sensors based on in-pixel photo-demodulating devices with a real case study example
- Sensors based on extensive use of electronics in the pixel with a real case study example
- Figure of merits of ToF image sensors
This workshop will introduce participants to the rapidly emerging field of three-dimensional imaging, providing a detailed overview about solid-state image sensor architectures capable of time-of-flight distance measurement. An introduction about existing 3D imaging technologies will be given, addressing the peculiarities of each measuring technique and the possible application domains. The main focus of the workshop will be on 3D-ToF detectors with in-depth case-studies analysis, dividing pixel structures in three main classes: photo-demodulator devices, extensive use of pixel-level electronics with fast shutter capabilities and single-photon avalanche detectors. Finally, participants will get some practical tools such as figure of merits and experimental characterizations guidelines for a comprehensive comparison of 3D imagers performances and a perspective toward the future challenges in this exciting and fast evolving field.
About your leaders:
David Stoppa received the Laurea degree in Electronics Engineering from Politecnico of Milan, Italy, in 1998, and the Ph.D. degree in Microelectronics from the University of Trento, Italy, in 2002. In 2010 he became head of the Smart Optical Sensors and Interfaces research unit at Fondazione Bruno Kessler (FBK, formerly ITC-IRST), where he has been working as a research scientist since 2002 on the development of CMOS sensors for advanced applications.
Since 2000 he has been teaching at the Telecommunications Engineering faculty of the University of Trento, courses of Analogue Electronics and Microelectronics. His research interests are mainly in the field of CMOS integrated circuit design, image sensors and biosensors. He has authored or co-authored more than 60 papers in international journals and presentations at international conferences, and holds two patents in the field of image sensors. Dr. Stoppa received the 2006 European Solid-State Circuits Conference Best Paper Award.
Lucio Pancheri received the Laurea degree in Materials Engineering from the University of Trento, Italy, in 2002, and the Ph.D. in Information and Communication Technologies from the University of Trento in 2006. During his Ph.D. he has worked on the design and characterization of novel silicon photodetectors for 3-D imaging applications.
In 2006, he joined the Integrated Optical Sensors Group, Fondazione Bruno Kessler (FBK), as a Research Scientist. From August 2007 to August 2010 he has been a post-doctoral fellow at FBK, where he was mainly involved in the development of Single Photon Avalanche Diodes and readout circuits for fluorescence lifetime detection. He is currently a resercher at FBK working on optical sensors for advanced imaging and biomedical applications.
Matteo Perenzoni was born in Rovereto, Trento, Italy, in 1977. He received the Laurea degree in Electronics Engineering from the University of Padua, Padua, Italy, in 2002. In 2002, he was with the University of Padua, where he worked on the design of an integrated circuit implementing an analog decoder.
Since January 2004, he has been with the Center for Materials and Microsystems of the Fondazione Bruno Kessler (FBK-CMM, formerly ITC-irst), Trento, Italy, as a Researcher working in the Smart Optical Sensors and Interfaces research unit. He collaborates on teaching courses of electronics and sensors for the NanoMicro Master, Trento. His research interests include the design of advanced vision sensors for X-ray, infrared, and terahertz, as well as the modeling and optimization of analog integrated circuits.