Ahead of Image Sensors Europe 2019, we caught up with Alberth Theuwissen, Founder of Harvest Imaging for a 60 second interview.
Introduction about Alberth Theuwissen
Albert Theuwissen has 40+ years of experience in the field of solid-state image capturing, and worked for Philips Research, Philips Semiconductors, DALSA and in 2007 he founded his own company, Harvest Imaging. Albert was elected to be the Electronic Imaging Engineer of the Year in 2012 and won the SMPTE Fuji Gold Medal in 2008.
Harvest Imaging is focusing on :
- Teaching and trainings in the digital image capturing world,
- Reporting about technical topics (e.g. auto-focus pixels; reproducibility, variability and reliability of CMOS image sensors),
- Consulting in the field of digital image capturing,
- Yearly 2-days forum on a specific subject of the digital imaging world.
For more information : www.harvestimaging.com
What will you be discussing at Image Sensors Europe
The topic of the talk will be the difference of what is mentioned in a data sheet and the real performance of a sensor when implemented in a camera. First of all a few minutes will be spent to show the lack of information in a data sheet. It is really a shame to see what crucial performance parameters are missing in a data sheet. Next a very simple method will be shown how to obtain the missing performance parameters. At the end of the talk the obtained results from an existing camera will be compared with the data sheets.
What challenges do you see industry facing at the moment?
The technology used for CMOS image sensors is getting more complex, almost by the day (BSI, DTI, boxed CFA, stacking, …). Only a few companies can follow this technology race, and that basically means that the leading suppliers in the field will become only stronger. For the smaller companies it will be very difficult, not to say impossible, to follow this technology race.
Can you share an interesting fact with us?
In 1995 it was mentioned that CCDs were (becoming) dinosaurs. But what we do see these days in the advanced CIS technologies : more and more building blocks of CCDs are coming back into the CIS fabrication processes. Examples are TDI in CMOS, global shutter in the charge domain, etc.