Conference day 1 - 13 March 2019

Conference day 1

Wednesday 13 March

  1. Event registration and morning refreshments

  2. Chair's opening remarks

KEYNOTES

  1. Image sensor technology trends

    Vladimir Koifman | Chief Technology Officer of Analog Value

    Image sensor technology is in transition now: 4T RGB pixels are very close to perfection, smartphone makers look for camera quality differentiation and cost efficiency, image sensor companies look for new markets. Meanwhile, some new technologies are in search of applications that can exploit their advantages, while other applications are in search of technologies that can fit them. The talk attempts to give a snapshot of the whole ecosystem and its controversies.

  2. Image sensor innovation and market roadmap

    Taner Ozcelik | Senior Vice President & General Manager, Image Sensing Group of ON Semiconductor

    Session details to follow shortly

  3. Sensor x DNN

    Tomoo Mitsunaga | General Manager of Sony

    Recent dramatic evolution of image understanding and machine vision technologies has been made by deep neural networks (DNNs) and huge amounts of computing power. For now, the evolution is extending to the edge of the information network where there are a vast numbers of sensors working with the sensor signal processing. The presenter introduces a survey on the recent DNN-based approaches for sensor signal processing and summarizes what we expect from this evolution.

  4. Technologies for smart optical sensors

    Roberto Bez | SVP of R&D of LFoundry

  5. Networking refreshment break

ADVANCES IN IMAGE SENSOR TECHNOLOGIES

  1. Quanta Image Sensors: imagers with sub-micron and deep-sub-electron read noise pixels

    Dr. Saleh Masoodian | CEO of Gigajot Technology

    Quanta Image Sensors (QIS) are imagers with high-speed photon counting and photon number resolving capabilities at room temperature. Being compatible with mainstream CMOS processes, the photon-counting pixels can be implemented with different sizes ranging from sub-micron to more than 10 micron for different applications. Combining read noise lower than 0.25e- rms, dark current lower than 0.1e-/pixel/sec at room temperature and intra-scene dynamic range more than 100dB, among other fascinating features make QIS a major paradigm shift in the imaging industry. QIS is a platform technology and can serve a variety of imaging applications ranging from high-end to consumer.

  2. Organic-Photoconductive-Film CMOS image sensor – advanced technology

    Kazuko Nishimura | Chief Researcher of CMOS Image Sensor Development of Panasonic

    Panasonic has developed a CMOS image sensor with an organic photoconductive film (OPF) laminated on pixel circuits, different from those of a conventional silicon image sensors, in which the organic thin film for photoelectric conversion and the charge storage part for signal charge accumulation are completely independent. In this presentation, we focus on the advantageous features of the OPF image sensor; [1] technology that realizes over 120 dB simultaneous-capture wide dynamic range; [2] global shutter technology achieving high saturation signals per unit square that is 10 dB higher than that of silicon image sensors with the global shutter function, without sacrificing pixel area; [3] RGB-NIR sensor technology capable of controlling NIR sensitivity by simply controlling the voltage applied to the OPF. Moreover, we introduce about 8K4K high resolution sensor technologies with 60fps high frame rate, 450ke- high saturation signals, and the global shutter function at the same time. We believe these features of the OPF image sensor will contribute towards advancements in imaging and sensing fields.

  3. Stacked image sensors with photoconversion films

    Shigeyuki Imura | Research Engineer of Japan Broadcasting Corporation (NHK)

    Recently, several stacked image sensors overlaid with non-silicon photoconversion films have been presented to show some interesting performances. In this presentation we will first introduce the importance of the development of the stacked image sensors with photoconversion films and then explain our developed highly absorptive crystalline selenium (c-Se)-stacked CMOS image sensors. The presentation will cover research into high-sensitivity CMOS image sensors with c-Se photoconversion films; using avalanche multiplication in a c-Se film to obtain a high EQE; and demonstrating ultra-high-definition c-Se-stacked 8K image sensors to obtain a high- quality image. This new technology has a great potential to realize high-efficiency and high-definition imaging systems.

  4. Networking lunch

Industrial Applications

TRACK A - INDUSTRIAL APPLICATIONS

  1. Development of monolithic CMOS sensors for high energy physics

    Walter Snoeys PhD | Senior Electronics Engineer of CERN

    Silicon sensors and CMOS readout chips revolutionized particle physics experiments, and have been a cornerstone in the discovery of the Higgs boson by the ATLAS and CMS experiments at the Large Hadron Collider at CERN. Today hybrid detectors with readout and sensor implemented in different silicon chips are in overwhelming majority, but monolithic active pixel sensors (MAPS) have received significant attention because they offer easier detector assembly, lower cost, and other advantages like lower material and higher granularity. Commercial CMOS technologies offer significant radiation tolerance and substrates compatible with particle detection and combine circuit performance and density with volume production capability. MAPS in commercial CMOS technologies have been used for the first time in the STAR experiment, adopted for the ALICE experiment, and are being considered for the most aggressive applications, like the ATLAS HL-LHC upgrade and future colliders like the FCC and CLIC. Significant improvements are made in every iteration with challenges in sensor and front end design, architecture, speed, timing, radiation tolerance and system issues. This presentation will give an overview.   

  2. How can image sensors tackle the current and future challenges of the flat panel display industry?

    Rafael Romay | Vice President & General Manager, Professional Imaging of Teledyne e2v

    The number of display screens on everyday objects is increasing, and a good indicator of the outstanding potential of the global display market, which should reach 150b$ in 2022. However, display manufacturers are today at a crossroad. They are threatened by increasing price and quality constraints as well as rising R&D expenses, as they move to develop immature technologies such as flexible and rollable displays. In this presentation we will explore the emerging challenges of the display industry and how the new generation of global shutter CMOS Image Sensors, such as the Emerald 67M from Teledyne e2v, offers an innovative solution to tackle these issues with no compromise on image quality.

  3. Networking refreshment break

  4. Autonomous data logger with ultra-low power imager

    Dr L. Andrea Dunbar | Section Head, Embedded Vision Systems of CSEM SA

    We present an autonomous vision system comprising of an ultra-low power imager, custom optics, and thin flexible silicon photovoltaic sticker. The image sensor is a 120 dB dynamic range 600 µW QVGA image sensor, based on a time to saturation pixel with in-pixel A/D conversion and data memory, it offers a logarithmic data representation on 10-bit.  The challenge of creating such a highly integrated system for IoT application and future needs for IoT applications will be also addressed.

  5. Computational image sensor - mosaic/matrix shutter

    Tomas Kovacovsky | CTO of Photoneo

    • High resolution 3D sensing in motion (Parallel Structured Light)
    • Comparison with different approaches and advantages
    • Computational image sensor as a tool to make any sequential vision approach "one shot"
    • Other use cases
  6. Presentation to be confirmed

  7. Chair's closing remarks and close of conference day one

  8. Networking drinks reception and Image Sensors Europe Awards 2019

    Smithers Apex staff will leave the hotel at 17.45 sharp to walk to Skyloft for a fantastic evening of informal networking and the presentation of the Image Sensors Europe 2019 Awards. 

Biomedical Applications

TRACK B - BIOMEDICAL APPLICATIONS

  1. CMOS image sensors for direct visualisation in minimally invasive medical procedures

    Tehzeeb Gunja | Principal Marketing and Business Development Manager of OmniVision Technologies

    • Market analysis and trends
    • Growth drivers
    • Shift from reusable to disposable
    • Ultra-small imagers expands endoscopic opportunity set
    • Technology trends
    • Endoscopic types, coverage and solutions
    • Medical testing and QA
  2. 3D stacked image sensors for industrial and medical imaging

    Tim Baeyens | Co-founder & CEO of Gpixel NV

    Limitations in monolithic image sensor approach can be overcome by using a 3D stacked sensor design. In such design we can introduce much higher level of parallelism, with much shorter control signal tracks, higher flexibility in control on smaller pixel blocks, higher degree of multiplexing, etc. In medical X-ray imaging, 3D stacked approach possible improvements compared to monolithic sensors will be discussed.

  3. Networking refreshment break

  4. What are the new technological trends in the field of X-ray imaging?

    Marjorie Villien | Technology and Market Analyst, Medical Imaging and Biophotonics of Yole Développement

    If we dive into the X-ray detector market, we see that the competition between sensor technologies is still exciting. a-Si flat panels dominate the X-ray market but CMOS flat panels are gaining market share, with high interest from players. But a-Si flat panel players have not yet had their last words, with new technologies coming from flexible screens using organic materials! The technological trend in X-ray is also to pursue single-photon counting but the solution is still very expensive.

  5. How developments in miniature image sensors enable breakthrough in single-use urethroscopes

    Speaker to be confirmed, ams AG

    The adoption in urology of single-use endoscopes based on CMOS image sensors is accelerating. ams will describe how demand from surgeons for better image quality has led to the development of new image sensors in form factors of 1mm x 1mm or smaller. ams will explain how on-wafer lens fabrication techniques and new CMOS pixel architectures enable the development of high-resolution urethroscopes at a cost low enough to support single use, eliminating the problems with reusable endoscopes.

  6. Chair's closing remarks and close of conference day one

  7. Presentation to be confirmed

  8. Networking drinks reception and Image Sensors Europe Awards 2019

    Smithers Apex staff will leave the hotel at 17.45 sharp to walk down to Skyloft for a fantastic evening of informal networking and the presentation of the Image Sensors Europe 2019 Awards.