Conference day 2 - 14 March 2019

Conference day 2

Thursday 14 March

  1. Delegate sign-in and morning refreshments

  2. Chair's opening remarks

    Anders Johannesson | Senior Expert - Imaging Research and Development of Axis Communications

  3. Datasheets and real performance of CMOS image sensors

    Albert Theuwissen | Founder of Harvest Imaging

    Devising simple measurements to characterize an image sensor - reinforcing the central performance parameters of the technologies we are working with


  1. Future home camera products

    Ilya Brailovskiy | Principal Engineer of Amazon Lab126

    In this talk, we will discuss some of the challenges with designing and delivering home camera devices at scale. We will also touch upon some of the future technologies that will enable better user experience as well as new and inspiring usages

  2. 3D image sensing for face recognition / AR

    Gur Arie Bitan | CEO of Mantis Vision

  3. Toward wide-scale adoption of event-based vision

    Luca Verre | Co-founder and CEO of Prophesee

    Neuromorphic event-based vision is a new paradigm in imaging technology inspired by human biology. It promises to improve the ability of machines to sense their environment and make intelligent decision about what they see.  Event-based vision is characterized by high speed acquisition of scene dynamics at low data rates, high dynamic range and low power consumption.

    Currently, the pixel size of event-based sensors is not competitive compared to conventional imagers. Moreover, the equivalent of an ISP as the ones developed for frame-based sensors and automatic camera controls are not reaching the required levels of maturity. Finally, the nature of the data generated by an event-based sensor requires the development of new approaches to vision processing, machine learning and computational architectures. At Prophesee we are currently addressing these known limitations to enable a seamless transition to an event-based world of vision.

  4. Networking refreshment break

  5. Presentation to be confirmed

    Dr. Bernd Buxbaum | CEO/CTO, Founder of pmdtechnologies, Germany

  6. Ultrafast laser videography

    Andreas Ehn | Division of Combustion Physics, Department of Physics of Lund University

    • Introduction to ultrafast laser imaging & videography
    • New image coding concept: FRAME (Frequency Recognition Algorithm for Multiple Exposures)
    • Ultrafast videography using FRAME image coding strategy
  7. From compressive sensing to artificial intelligence

    Igor Carron | CEO and Co-Founder of LightOn

    For the past 16 years, Compressed Sensing has provided a new framework for sensing the world around us. In this talk, we will describe how Compressed Sensing has evolved from a statement about under-determined systems of linear equations to the design of new physical sensing systems and eventually to the analysis of high dimensional data and algorithm development in Machine Learning. We will then present more recent development on how compressed sensing hardware can be used as computational tools for Artificial Intelligence.

  8. Challenges of Single Photon LiDar and 3D Imaging

    Matteo Perenzoni | Head of IRIS Research Unit of Fondazione Bruno Kessler (FBK)

    The talk will address the common challenges of LiDar and 3D imaging, such as scanning/flash, background light, detector sensitivity, showing that some common understanding of the issues may not be always true.

  9. Networking lunch

  10. Afternoon Chair

    Markus Cappellaro | Product Manager and Principal of Carl Zeiss Microscopy Technology Center Munich

  11. Developments in thin film photodiode based imagers enabling near-infrared imaging

    Dr Pawel Malinowski | Program Manager “User Interfaces & Imagers” of Thin Film Electronics Group, imec

    Dr Pawel Malinowski

    Photodetector pixel stacks based on organic and quantum dot materials can enable monolithic integration of thin-film photodiodes directly on top of CMOS readout circuits. This allows infrared imaging beyond silicon’s cut-off wavelength (above 1100 nm) in a compact form factor. At the same time, wafer-scale fabrication promises high throughput and thus low cost of imagers with high pixel density and megapixel resolution. In this presentation, we will summarize recent progress on pixel and integration concepts and present our photodetector and image sensor results.

  12. Hyperspectral imaging

    Jurgen Hillmann | COO of XIMEA


  1. Pros and cons of using GENCAM based standard interfaces (GEV, U3V, CXP, and CLHS) in a camera or image processing design

    Werner Feith | System Architect of Euresys S.A.

    When design image processing applications in hard and software today, as cameras, FPGA embedded processing or PC applications it is a big task select the right interfaces in function and bandwidth for the complex system. This paper shall present existing specifications which are well established in the market and can help in building the system.

  2. Chair’s closing remarks and end of Image Sensors Europe 2019