Review the 2021 programme 
Masterclass 1
LiDAR and consumer photography: applications with a common denominator

Date - 12 March 2021
Time - 10am-12pm CET (9am-11am GMT)
Ticket price - £199 + VAT

This workshop focuses on novel techniques for LiDAR imaging and consumer photography based on time-resolved cameras. The aim is to improve image quality under extreme conditions. We study these applications in light of recent developments of time-resolved cameras based on SPADs, with particular attention to (ad hoc) highly integrated image sensors.

Quantum techniques for improvement of SBR and SNR (and their sensors)
- conventional ghost imaging (signal and idler on different paths)
- quantum LiDAR
- signal and idler on different paths
- signal and idler on same path
- non-line-of-sight LiDAR
- coincidence and progressive-gating LiDAR
- quantum plenoptic cameras
- g2 imaging
- quantum distillation

Quanta burst photography and computed photography (and their sensors)
- blur-compensated long-exposure imaging
- super resolution
- low-light-level imaging and color
- machine-learning based 4D reconstruction of light-in-flight
- computed, scintillator-based gamma detection

Prof. Edoardo Charbon | Chair of VLSI, EPFL
Masterclass 2
CMOS image sensor developments since Image Sensor Europe 2020

Date -  Wednesday 17 March 2021 (3.5 hours)
Time - 9am CST (8am GMT)
Ticket Price - £349 + VAT 

During the IS Europe 2019 and 2020, a workshop was organized around recent developments in the CIS world. Because of the success of those workshops, a similar workshop will be repeated at IS Europe 2021.  A lookback of the developments over the last 12 months will be given, including critical comments on the published papers and data-sheets.  In many cases the information made available to the general public contains a lot of rubbish and data that makes no sense.  The speaker will analyse the figures and numbers published and will compare them to data available from other companies.  A real, unbiased benchmark of performance data will be given in the workshop. 

Session 1

  • Introduction
  • Numbers
  • High Dynamic Range
  • Voltage Domain Global Shutter 

Session 2

  • Low Noise
  • Colour Filter News
  • Phase Detective Auto-Focus Pixels
  • The Extremes

Session 3

  • New materials
  • Beyond Silicon in the Near-IR
  • Event-Based Imagers PTC in Dark
  • Conclusion

Albert Theuwissen | Founder, Harvest Imaging
Day 1 - Tuesday 23 March 2021
Chair's opening remarks
Charge focusing SPAD: Towards multi-megapixel photon counting arrays
Post-pandemic opportunities and market shifts
Short presentations will be followed by a joint Q&A:
  • Where has opportunity arisen out of the pandemic for sensors?
    • Which applications have seen growth?
    • Are these contextual or long-term opportunities?
  • What will happen to image sensors after the 
pandemic? What will change in the business?
Chenmeijing Liang, Analyst, Yole Développement
Igor Ivanov, Head of Smart Sensing Group, ADASKY
Networking break including roundtable discussions
Take this time to attend a roundtable discussion, visit the virtual exhibition and take meetings with speakers, sponsors and other attendees.

Confirmed roundtables:
Optics and filters for the future - addressing the increase in demand for multispectral and IR sensors – Led by Sara Pellegrini, Advanced Photonics Pixel Architect, STMicroelectronics

Image sensor artefacts are not listed in the data sheets: which effects and behaviours did you discover in your projects? - Led by Markus Cappellaro, Product Manager and Principal, ZEISS Microscopy Technology

How important is it to know the exact zero level of the sensor? – Led by Anders Johannesson, Senior Expert - Imaging Research and Development, Axis Communications
Latest developments in high-speed image sensors for industrial, scientific and professional use
This presentation will cover the latest (r)evolutions in high speed imaging with a strong focus on latest product and technology advance for industrial inspection applications achieving stunning 20 Gpix/s and 192 Gbps image data through put with low noise read out. Future outlook is provided too on novel technology concept of next generation products aiming to achieve 40 Gpix/s and 400 Gbps.
Wim Wuyts | Chief Commercial Officer, Gpixel
CMOS design for space and industrial application: mutual benefits
The mutual technology benefits between space and industrial developments have rarely been discussed. The acceleration of both CMOS quality and space CMOS applications has now provided a new environment where both type of applications can take advantage of their respective developments. The presentation will provide silicon results of these key technologies: TDI-on-CMOS solutions, UV and deep UV ARC, HiRho technology for high QE and excellent MTF for NIR applications. Last, the technology trend including SPAD, Hybrid and 3D stacking foreseen for coming years will be presented.
Jérôme Pratlong | CMOS Chief Engineer, Teledyne e2v
A Time-of-Flight imaging system for the brain
Time-Domain Near-Infrared Spectroscopy (TD-NIRS) has been considered the gold standard of NIRS as it offers more information per channel than its continuous wave (CW) counterparts.  At Kernel, we have used TD-NIRS to build an active Time-of-Flight (ToF) image sensor system for functional brain imaging.  In this talk, I will discuss the challenges of building a scalable ToF brain imaging system and describe the architecture that has made it possible. I will share details of our module optical designs along with measurement results that demonstrate our system performance on both phantoms and human participants.
Ryan Field | CTO, Kernel
Networking break including roundtable discussions
Take this time to attend a roundtable discussion, visit the virtual exhibition and take meetings with speakers, sponsors and other attendees.

Confirmed roundtables:
COVID as enabler of wider scope and pervasion for sensing – Led by Sara Pellegrini, Advanced Photonics Pixel Architect, STMicroelectronics

ISSCC 2021 - where are "hyperactive" pixels in stacked technologies going? – Led by Robert Henderson, Professor of Electronic Imaging, University of Edinburgh
Phase-Detection Auto-Focus pixels
Trends in mobile photography and under display FaceID based on ToF and AI - SILVER SPONSOR
Dr Bernd Buxbaum is the CEO and founder of pmdtechnologies, the pioneer of 3D Time-of-Flight depth-sensing technology.

In his presentation he will give an in-depth look into the future advancements of 3D data by using artificial intelligence and combining it with application specific sensor optimizations like Spot iToF for increased performance in changing use-case scenarios.
Dr Bernd Buxbaum | CEO, pmdtechnologies
Under OLED and Under LCD optical fingerprint sensors - SILVER SPONSOR
Fingerprint identification for cellphones has long become a standard in today’s market. The requirement of having the sensor under the cellphone screen has led to the development of optical fingerprint sensors which provide higher performance and cost advantages as compared with other available alternatives (e.g. ultrasonic sensors). Due to the size and constraints of fingerprint sensors, 0.18um CIS technology platform provides an ideal solution.   The implementation of these sensors is classified into lens-type sensors, that have a system lens like traditional cameras, and 1:1 sensors, where the sensor works in proximity to the finger and uses a collimator instead of a lens. The lens-type sensors are widely used for under OLED and under LCD cellphone screens. If used under LCD, these sensors work in the NIR wavelength with a dedicated NIR light source. The 1:1 sensors are used for ultrathin smartphones using OLED screens, (usually the higher end cellular phones). 
Tower offers specialized solutions for both sensor types. Low noise and pixels with internal memory nodes for the lens-type sensors, and cost-effective high-performing pixel to the large 1:1 sensors. For the latter, a collimator optics–based on large elevated micro-lenses was developed, compatible with a thin film IR-cut filter. 
Dr. Amos Fenigstein | Senior Director of CIS Research & Development, Tower Semiconductor
How consumer-oriented spectral cameras enable new features - SILVER SPONSOR
Chair's closing remarks
End of day one networking
Take this time to visit the virtual exhibition and take meetings with speakers, sponsors and other attendees.
Day 2 - Wednesday 24 March 2021
Chair's opening remarks
Art of S/N for security applications
One major challenge in security sensors is to enhance S / N performances. The definition of S/N itself and the factors that determine it are various. In my presentation, I will show you what kind of thought we have when developing products and sensor technologies for security applications, what elements we are focusing on, and what we have improved , while showing actual examples of technologies and products. In addition, I would like to introduce one of the possibilities for future technology.
Takamasa Wada | General Manager, Sony Semiconductor Solutions Corporation
Short-Wave Infrared breaking the status quo – identifying hazards on the road and solving the low visibility challenge
One of the major challenges for ADAS & AV is the ability to operate in all weather & lighting conditions. ADAS solution architects are realizing existing sensor fusion fails to detect hazards under common low-visibility conditions when most accidents occur. Meaning machine vision algorithms are unable to make safe driving decisions. The fact that the ADAS technology on the market can reduce the likelihood and severity of an accident is undisputed, but until now, it has not been able to offer a reliable solution. Based on advanced research, TriEye is breaking the sensor fusion status-quo with its industry-first CMOS-based SWIR camera that is finally able to bridge that gap.

- Current Sensor Fusion blind spots
- Why SWIR spectrum can support automotive applications better than other sensor modalities
- Critical low visibility use cases solved by the SWIR camera (fog, dust, night time, etc.)
- Experimental results which compare target contrast of Visible and SWIR camera images in different low visibility conditions
Avi Bakal | Co-Founder & CEO, TriEye
Latest advancements in automotive High Dynamic Range image sensors
Automotive imaging sensor cameras are important parts of ADAS and autonomous driving systems. They provide visual information about car surround environment including shape, color, and texture of different objects such as vulnerable road users, traffic signals, signs, cars, trucks, road markings, and so on. We presented comparative analysis of modern high dynamic range (HDR) automotive image sensors. Latest advancements in these sensors improve safety metrics at a constant speed, or enable a fixed Use Case at higher speeds, ex. more freeway autonomy or automated driving above standard speed limits.
Sergey Velichko | ASD Technology and Product Strategy Director, ON Semiconductor
Joint Q&A
Networking break
Take this time to visit the virtual exhibition and take meetings with speakers, sponsors and other attendees.
IMAGE PROCESSING - Sponsored by GrAI Matter Labs
Image processing at Gigapixels per second
Thanks to advances in CMOS technologies enabling multi-megapixel sensors with ultra-high frame rate capacity there is a growing demand for solutions that can process throughput rates of 10 to 100 Gbps and beyond. High-performance multi-sensor applications are becoming mainstream in diverse markets, notably in 3D imaging and autonomous mobile platforms. The enormous data generated by such applications creates formidable technological challenges to data acquisition, processing and storage.  
This presentation provides insights into the aforementioned challenge and provides a comparison of approaches to high data-rate processing in different applications, such as machine and embedded vision, medical imaging, broadcasting, and surveillance. 
Reuven Weintraub | Founder and CTO, Gidel
Assessing the future of AI for image sensors
  • What are practical applications of AI with sensors?
    • Understanding the commercial viability of using AI with sensors vs. the theoretical capabilities
  • How to you minimize cost and impact to existing processes when deploying AI
Christian Verbrugge, Head of Business Development EU, GrAI Matter Labs
Jonathan Hou, President, Pleora Technologies
Networking break
Take this time to join a visit the virtual exhibition and take meetings with speakers, sponsors and other attendees.
Challenges for the assembly of large format image sensors on PCBAs - SILVER SPONSOR
0.18 µm CMOS APD/SPAD with integrated breakdown voltage monitoring
A fundamental condition for an avalanche breakdown is, to have at least one carrier in the junction to trigger this event. For some applications under dark or low light environment this condition might not be given, so that the avalanche is not triggered. The detected breakdown voltage could shift to higher voltages. Because of such misinformation, the wrong reverse biasing on the APD/SPAD disturbs the functionality or lowers the performance. We propose an integrated solution within the APD/SPAD itself, to open the possibility for a reliable and very fast measurement. In addition to that, the new method is independent of environmental factors.
Alexander Zimmer | Principal Development Engineer for Optical Sensors, X-FAB Global Services GmbH
Plasmonic colour filters in CMOS technology for chip-scale spectrometers and multispectral imaging
Conventional colour filters based on dyes or pigments are limited to few spectral band (RGB in most cases). Alternatives like thin film filters can provide more spectral bands but require additional post processing steps adding significant cost to fabrication. We use nanostructured metal layers as on-chip spectral filters and implemented this technology in two different commercial CMOS foundries. This silicon proven technology will be presented in the form of chip-scale spectrometers based on photodiode arrays and filter arrays and we will show that these plasmonic filters are suitable for filters on pixel level, too.
Stephan Junger | Group Manager Optical Sensor Systems, Fraunhofer IIS
LYNRED from SWIR to LWIR infrared detection
Thanks to the fusion of SOFRADIR and ULIS companies, LYNRED product offer covers a large span of applications, in cooled and uncooled infrared domains. The presentation will focus on two detectors addressing two different infrared bandwidth: First a SWIR detector in InGaAs technology: advantages of this technology ... Then a LWIR camera module will be presented: an uncooled bolometers detector stacked with a custom IR image processor (ISP).
Patrick Robert | Senior Expert – Readout Circuit Design, LYNRED
Near infrared 3D sensing with active light sources
3D vision systems are transforming from the lab´s and high-end specialty applications to mass markets. Our focus in this presentation is on optimizing 3D system performance based on IR imaging sensors and VCSEL illumination. We will shine light on 3D time-of-flight, stereo-vision and new approaches for structured-light technology and the challenges that have to be overcome to achieve an optimal performing system for all ambient conditions.

We will show how 3D data is generated with different sensors, the key specifications of the infrared imaging sensors, the importance of latest state of the art laser based randomized dot illumination and miniaturized packaging. Use cases for from mobile phone to industrial market illustrate the wide application range a large potential of 3D vision.

A live demonstration will illustrate to the audience the latest technology achievements.
Matthias Gloor | Senior Product Manager, ams Sensing Modules and Solutions
Chair’s closing remarks and close of conference

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